08 Nov 2006
The MEMS Devices group has expertise and experience in many diverse sectors, and continues to expand upon this in order to provide a far-reaching service to BAE Systems and the MNT community.
Active Areas of Research and Technology
Techniques for fibre alignment, dielectric mirror deposition and shutter actuation structures allow us to produce a range of devices useful in the optical domain.
Wafer level bonding processes allow aligned multi wafer stacks to be produced with wafer-to-wafer alignment of +/-2um. Wafers can contain cavities with controlled environments and hermetic seals. Combined with Deep Reactive Ion Etching (DRIE) processes, bulk silicon structures can be defined with high aspect ratios and high process tolerances. These technologies lead to wafer scale packaged and 3-d structures.
Our aerospace heritage places us in a particularly strong position to design and develop devices based on fluid flow whether liquid or gas.
Micro-fluidic and immunoassay technology has opened up the possibility of producing a range of biologically important devices.
We have developed surface micromachining processes using polyimide sacrificial layers and a variety of dielectric and metallic structural layers. This low temperature process route has allowed us to produce ultra high yielding MEMS devices integrated with CMOS electronics and ultra low mass, low stress structures.
We are equipped to deposit a very wide range of thin film materials with specific properties. These can be tailored to specific sensing applications based on optical, electrical, mechanical or chemical properties.
Nano-Technology is a new and exciting area of research. We are actively looking into combining this new technology with our existing MEMS skills, to produce MEMS hosted nano-structures. We are collaborating with a number of universities and we would welcome industrial collaboration.
