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News Release

Engineers Develop 'Space Age' 3D Electronic Packaging

18 Jun 2007 | Ref. 179/2007

Great Baddow, United Kingdom. - Engineers from BAE Systems have created a way to design futuristic circuit boards, by turning complex but conventional two dimensional circuit boards into robust three dimensional structures.

CirCube™ is a design and manufacturing service which creates products resilient enough to withstand the hostile conditions and demands of the space environment.

Space qualified by NASA, ESA and CNES, the technology is already in use in a range of space vehicles such as satellites and comet chasers.  The product takes up less space than traditional circuit boards and is particularly suited to medical applications, such as cameras for endoscopes.

Cubes consist of stacked miniaturised circuit boards which are encapsulated and connected by laser-patterned metal on the edges of the cube.  CirCube™ can produce modules which are up to 75-per-cent smaller and 80-per-cent lighter than traditional solutions, making it ideal for applications where space is limited and weight reductions are crucial to efficiency, such as on aircraft and other autonomous vehicles.

CirCube™ provides a low-cost, high performance solution which developers claim is ‘future proof’ thanks to the fact that outdated parts can simply be removed and replaced. Additionally, engineers have developed a ‘pluggable’ device which allows the user to unplug and exchange cubes to quickly and efficiently update or modify the system or to create variants.

Nick Chandler, deputy head, Sensor Technology Department at BAE Systems’ Advanced Technology Centre said: “CirCube™ technology meets growing demand from a range of industries for higher levels of integration, reduced costs and faster product delivery.  The approach is so versatile that almost any type of component or package can be used on any part of the device – whether inside the cube or on the cube surface.  The cubes can also be mounted on boards alongside other components.”

The flexibility of CirCube™ means that engineers are able to develop a solution with the customer’s specific needs and challenges in mind.  The bespoke finished result enables the customer to benefit from unprecedented levels of performance for the lifetime of the product.

BAE Systems has partnered with 3D Plus to develop the technology.  3D Plus is the leading 3D electronics packaging company in Europe.  Together, the companies have worked to improve the sophistication of the technology and to adapt it for a range of industry – from avionics and automotive, to medical and consumer electronics.

About BAE Systems

BAE Systems is a global defence and aerospace company delivering a full range of products and services for air, land and naval forces, as well as advanced electronics, information technology solutions and customer support services. With 88,000 employees worldwide, BAE Systems' sales exceeded £13.7 billion pounds sterling (US25.4 billion dollars) in 2006.

For more information please contact:

John Neilson, BAE Systems
Tel: + 44 (0) 1252 384795 Mob: + 44 (0)7802 337704
john.neilson@baesystems.com

David Morris, Euro RSCG Biss Lancaster
Tel: +44 (0) 20 7467 9232 Mob: +44 (0) 7957 200 458
david.morris@bisslancaster.com

Issued by:

BAE Systems, Farnborough, Hampshire GU14 6YU, UK
Tel: +44 (0) 1252 384710 Fax: +44 (0) 1252 383947
www.baesystems.com


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