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Pressure Assisted Densification (PAD) Silicon Nitride Composite

BAE systems Pressure Assisted Densified (“PAD”) Silicon Nitride (Si3N4) is a fine grained, ceramic material having exceptional thermal and mechanical properties. BAE Systems produces three grades of “PAD” Si3N4 with diameters up to 560µm. BAE Systems NSG is a very fine grain Si3N4 with exceptionally high strength and good corrosion resistance. It is appropriate for demanding structural and wear resistant applications.
 
BAE Systems CI is a high strength Si3N4 with excellent high temperature mechanical properties. This material is excellent for wear and cutting tool applications. BAE systems SC-2 is high purity Si3N4 appropriate for the semiconductor industry. The following chart lists typical properties.

 

Grade of PAD Si3N4 SC-2 NSG CI
Bulk Density (min) g/cm^3              3.17 3.25 3.30
Average Grain Size

μm

1-2 0.6 0.5
Flexural Strength, (4-Pt MOR) Ksi 92 130 123
@RT MPa 640 900 850
Characteristic Strength MPa 675 930 865
Flexural Strength, (4-Pt MOR) Ksi - - 115
1000°C MPa - - 810
Weibull Modulus (m)

9

10 12
Elastic Modulus (E) GPa  320 300 310
Poisson's Ratio (n) 0.27 0.27 0.27
Hardness (Knoop 0.3 kg) kg/mm^2 1650 1450 1500
Fracture Toughness (Chevron Notch) MPa-m^1/2 4.9 5.5 6.0
Thermal Expansion (RT-1000°C) 10-6/°C 3.3 3.3 3.3
Thermal Conductivity @RT (W/m-K) 30 20 30
Electrical Resistivity

Ω-cm

>10^14 >10^14 >10^14

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