CirCube™

BAE Systems' CirCube™ advanced integrated electronic packaging service provides a world class design and development capability to deliver bespoke 3D System-In-Package solutions.

Our unique know-how and design methodologies enable our clients to benefit from unprecedented levels of performance, flexibility and development time achievable through 3D SiP.

The growing demand across industries to deliver higher levels of integration, lower costs and reduced time to market is driving the growth in System-In-Package solutions. With a proven pedigree in advanced 2D and 2½D electronic packaging solutions, we offer a unique set of design skills, methodologies and knowledge to deliver the next generation in 3D packaged solutions.

Recognising the different balance of drivers across markets for the adoption of high density packaging – such as size, speed, robustness, time to market and cost, CirCube™ delivers design flexibility to optimise solutions to clients’ specific needs.
Our integrated design and development capability offers a range of services that can be tailored to meet a customer’s specific requirements.

For further information on the CirCube™ service, please contact

Mark Whetton, BAE Systems ATC,
Tel:  +44 (0) 7801 716297,
mark.whetton@baesystems.com